Reactive hot melt
Adhesive combining an initial cooling-set stage with further product-specific chemical curing.
Also called: PUR
Material family: Adhesives, tapes, foams and sealing
Where it matters
Bond design, preparation, dispensing and cure qualification.
Testing and verification
Use the actual substrate, load mode, bondline, cure and ageing conditions; coupon strength is not a design allowable.
Related guides
Related products and materials
General information for preliminary evaluation; not independently reviewed or certified. Confirm grades, standards and suitability with the manufacturer for your application. Interpret within the exact material, grade and test method.